GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow

原文摘要 · 中英对照

GlobalFoundries reveals new details about its FDX Fusion technology, which promises 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography, shares what is next for FDX Fusion node, and the FDX program in general.

GlobalFoundries 披露了其 FDX Fusion 技术的新细节，该技术承诺使用平面 FD-SOI 晶体管、无需 EUV 光刻即可实现 7nm 级性能和 8nm 级逻辑密度，并分享了 FDX Fusion 节点的后续规划以及 FDX 项目的整体情况。